Banarta

XPS Tile Backer Boards

Wet Area XPS Insulated Tile Substrate

XPS-core insulated tile substrate with fiberglass and cement-based surfaces for wet-area enquiries. Confirm board thickness, support and the complete tiling and sealing system.

Insulated tile backing for wet-area projects

This tile substrate combines an XPS foam core with fiberglass and cement-based surfaces. Discuss it for wet-area tiled assemblies where both the insulation layer and the tile-backing construction are specified.

Select the board thickness and dimensions alongside the complete wall or floor build-up. Heating performance and energy use depend on the overall project; the board does not carry a guaranteed reduction in heating bills.

Published specifications

Features
Specifications
Density of XPS Foam Board
30-45kg/m3
Thermal Conductivity
0.028-0.036w/m.k
XPS Foam Core Compressive Strength
300kpa++
Flexural Strength
2.05±0.02Mpa
XPS Foam Core Color
Yellow/Blue/White/Pink/Green
Water Absorption(2-days immersion)
0.2%by volume
Flammability
Class E

Request the current datasheet and test conditions for the chosen configuration. Core strength and material water-absorption values do not establish a heavy-duty load rating or the waterproofing performance of a complete assembly.

Project details to confirm

  • Insulation requirement: required board thickness and the complete thermal build-up.
  • Support: substrate condition, frame or support details and board fixing method.
  • Tiling: adhesive compatibility, surface preparation and tile loading.
  • Wet-area sealing: joints, corners, fixings, penetrations and connections to adjacent waterproofing.
  • Heating systems: compatibility and installation requirements for the proposed floor assembly.

Use the matched board and sealing-system instructions. The board alone does not make a wet room watertight, and framed walls or shaped features require confirmed support and construction details.

Supply requirements

Send the application, board dimensions, thickness, quantity and delivery destination. Include the required system documentation and any packaging or private-label requirements.

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