BANARTA
BE-20 Modular EPS Floor Heating Panel
The BE-20 panel uses a molded expanded-polystyrene base with a HIPS film surface for hydronic floor heating. Its raised pipe-positioning profile and interlocking edges support an organized panel layout.
Product Specifications
Description | BE-20 |
Thermal Conductivity at 10℃ | 0.029W/(m.k) |
Heat Resistance | 0.8(m2.k)W |
Total Thickness | 40mm |
Compressive Strength | About 250KPA |
Size(L*W)in mm | 1370mm*720mm |
Thickness of Insulation Layer | 16mm |
Weight/M2 | 920g |
Standard Package | 11.4M2 |
Planning Your Floor Build-Up
Review the published total thickness and insulation layer against the space available in the floor assembly. Confirm pipe fit, spacing, screed requirements and the final floor finish with the project designer before installation.
For procurement, specify the BE-20 model, required quantity and delivery requirements. Request the relevant technical documentation where the project has defined loading or compliance requirements.
View the EPS underfloor heating installation video.